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C18140
| Elements | ||||
|---|---|---|---|---|
| Cu(1,2) | Cr | Si | Zr | |
|
(1) Cu value includes Ag. (2) Cu + Sum of Named Elements 99.5% min. |
||||
| Min (%) | 0.15 | 0.005 | 0.05 | |
| Max (%) | Rem | 0.45 | 0.05 | 0.25 |
| Form | Temper | Temper Code | Tensile Strength (ksi) |
Elongation (%) |
Vickers Hardness, 500 gm |
|---|---|---|---|---|---|
| * Measured at room temperature, 68°F (20°C). | |||||
| Flat Products | Hard | H04 |
57 Min |
8 Min |
147 Typ |
| Spring | H08 |
71 Min |
5 Min |
170 Typ |
|
| Melting Point - Liquidus°F | 1976 |
|---|---|
| Densitylb/cu in. at 68°F | 0.322 |
| Specific Gravity | 8.9 |
| Electrical Conductivity% IACS at 68°F | 85 |
| Thermal ConductivityBtu/ sq ft/ ft hr/ °F at 68°F | 210 |
| Coefficient of Thermal Expansion 68-57210 to -6 power per °F (68 – 572°F) | 9.72 |
| Modulus of Elasticity in Tensionksi | 17000 |
Fabrication Properties
No fabrication properties for this alloy
Common Fabrication Processes
No fabrication process properties for this alloy
Thermal Properties
No thermal properties for this alloy
| Product Category | Product | Reason Category | Reason |
|---|---|---|---|
| Electrical | Connectors | Conductivity (Electrical) | Electrical Conductivity |
| Connectors | Mechanical Properties | Strength | |
| Connectors | Solderability | Solderability | |
| IC-Lead frames | Conductivity (Electrical) | Electrical Conductivity | |
| IC-Lead frames | Solderability | Solderability | |
| Transistor lead frames | Conductivity (Electrical) | Electrical Conductivity | |
| Transistor lead frames | Solderability | Solderability |
Applicable Specifications
No applicable specifications for this alloy
Corrosion Properties
No Corrosion Properties Available.