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C18140
Elements | ||||
---|---|---|---|---|
Cu(1,2) | Cr | Si | Zr | |
(1) Cu value includes Ag. (2) Cu + Sum of Named Elements 99.5% min. |
||||
Min (%) | 0.15 | 0.005 | 0.05 | |
Max (%) | Rem | 0.45 | 0.05 | 0.25 |
Form | Temper | Temper Code | Tensile Strength (ksi) |
Elongation (%) |
Vickers Hardness, 500 gm |
---|---|---|---|---|---|
* Measured at room temperature, 68°F (20°C). | |||||
Flat Products | Hard | H04 |
57 Min |
8 Min |
147 Typ |
Spring | H08 |
71 Min |
5 Min |
170 Typ |
Melting Point - Liquidus°F | 1976 |
---|---|
Densitylb/cu in. at 68°F | 0.322 |
Specific Gravity | 8.9 |
Electrical Conductivity% IACS at 68°F | 85 |
Thermal ConductivityBtu/ sq ft/ ft hr/ °F at 68°F | 210 |
Coefficient of Thermal Expansion 68-57210 to -6 power per °F (68 – 572°F) | 9.72 |
Modulus of Elasticity in Tensionksi | 17000 |
Fabrication Properties
Common Fabrication Processes
Thermal Properties
Product Category | Product | Reason Category | Reason |
---|---|---|---|
Electrical | Connectors | Conductivity (Electrical) | Electrical Conductivity |
Connectors | Mechanical Properties | Strength | |
Connectors | Solderability | Solderability | |
IC-Lead frames | Conductivity (Electrical) | Electrical Conductivity | |
IC-Lead frames | Solderability | Solderability | |
Transistor lead frames | Conductivity (Electrical) | Electrical Conductivity | |
Transistor lead frames | Solderability | Solderability |
Applicable Specifications
Corrosion Properties