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C19015
Elements | |||||
---|---|---|---|---|---|
Cu(1,2) | P | Ni | Mg | Si | |
(1) Cu + Sum of Named Elements 99.8% min. (2) Cu value includes Ag. |
|||||
Min (%) | 0.02 | 0.50 | 0.02 | 0.10 | |
Max (%) | Rem | 0.20 | 2.4 | 0.15 | 0.40 |
Mechanical Properties
Densitylb/cu in. at 68°F | 0.322 |
---|---|
Specific Gravity | 8.91 |
Thermal ConductivityBtu/ sq ft/ ft hr/ °F at 68°F | 148.8 |
Coefficient of Thermal Expansion 68-57210 to -6 power per °F (68 – 572°F) | 9.3 |
Modulus of Elasticity in Tensionksi | 18500 |
Fabrication Properties
Common Fabrication Processes
Thermal Properties
Product Category | Product | Reason Category | Reason |
---|---|---|---|
Electrical | Connectors | Conductivity (Electrical) | Electrical Conductivity |
Connectors | Conductivity (Thermal) | Thermal Conductivity | |
Connectors | Forming Characteristics | Formability | |
Connectors | Mechanical Properties | Fatigue Strength, High | |
Connectors | Mechanical Properties | Strength, High | |
Connectors | Mechanical Properties | Thermal Softening Resistance | |
IC-Lead frame semi-conductor material | Conductivity (Electrical) | Electrical Conductivity | |
IC-Lead frame semi-conductor material | Conductivity (Thermal) | Thermal Conductivity | |
IC-Lead frame semi-conductor material | Mechanical Properties | Fatigue Strength, High | |
IC-Lead frame semi-conductor material | Mechanical Properties | Strength, High | |
IC-Lead frame semi-conductor material | Mechanical Properties | Thermal Softening Resistance |
Form | Specific Sub-Form | Application | System | Standard | Description |
---|---|---|---|---|---|
Sheet & Strip | ASTM | B422/B422M | COPPER-ALUMINUM-SILICON-COBALT ALLOY AND COPPER-NICKEL-ALUMINUM-SILICON ALLOY SHEET AND STRIP | ||
Strip | ASTM | B888/B88M | COPPER ALLOY STRIP FOR USE IN MANUFACTURE OF ELECTRICAL CONNECTORS OR SPRING CONTACTS |
Corrosion Properties