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C45470
Elements | |||||
---|---|---|---|---|---|
Cu(1) | Pb | Sn | Zn | Al | |
(1) Cu + Sum of Named Elements 99.5% min. |
|||||
Min (%) | 64.0 | 0.6 | 0.30 | ||
Max (%) | 69.0 | .09 | 0.9 | Rem | 0.8 |
Form | Temper | Temper Code | Tensile Strength (ksi) |
Elongation (%) |
---|---|---|---|---|
* Measured at room temperature, 68°F (20°C). | ||||
Rod | 1/2 Hard | H02 |
63 Typ |
23 Typ |
Tube | Drawn General Purpose | H58 |
60 Typ |
27 Typ |
Wire | 1/2 Hard | H02 |
61 Typ |
25 Typ |
Soft Anneal | O60 |
49 Typ |
50 Typ |
Melting Point - Liquidus°F | 1688 |
---|---|
Densitylb/cu in. at 68°F | 0.304 |
Specific Gravity | 8.4 |
Electrical Conductivity% IACS at 68°F | 26 |
Thermal ConductivityBtu/ sq ft/ ft hr/ °F at 68°F | 67 |
Coefficient of Thermal Expansion 68-57210 to -6 power per °F (68 – 572°F) | 11.7 |
Modulus of Elasticity in Tensionksi | 15000 |
Technique | Suitability |
---|---|
Soldering | Good |
Brazing | Good |
Spot Weld | Good |
Butt Weld | Good |
Capacity for Being Cold Worked | Good |
Common Fabrication Processes
Thermal Properties
Typical Uses
Applicable Specifications
Corrosion Properties