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C50990
Elements | ||||||
---|---|---|---|---|---|---|
Cu(1) | Pb | Sn | P | Ni | S | |
(1) Cu + Sum of Named Elements 99.5% min. |
||||||
Min (%) | 3.0 | 0.03 | 0.6 | 0.10 | ||
Max (%) | Rem | 0.09 | 5.0 | 0.35 | 1.2 | 0.50 |
Form | Temper | Temper Code | Tensile Strength (ksi) |
YS-0.2% Offset (ksi) |
Elongation (%) |
---|---|---|---|---|---|
* Measured at room temperature, 68°F (20°C). | |||||
Wire |
54 Min 87 Typ |
80 Typ |
10 Typ |
Melting Point - Liquidus°F | 1926 |
---|---|
Melting Point - Solidus°F | 1675 |
Densitylb/cu in. at 68°F | 0.319 |
Specific Gravity | 8.84 |
Electrical Conductivity% IACS at 68°F | 19.1 |
Thermal ConductivityBtu/ sq ft/ ft hr/ °F at 68°F | 47.4 |
Poisson's Ratioksi | 0.34 |
Technique | Suitability |
---|---|
Soldering | Excellent |
Brazing | Good |
Machinability Rating | 70 |
Common Fabrication Processes
Product Category | Product | Reason Category | Reason |
---|---|---|---|
Electrical | Electrical Connectors | Electrical Conductivity | |
Conductors, Electrical and Thermal, High Strength |
Applicable Specifications
Corrosion Properties