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C50990
| Elements | ||||||
|---|---|---|---|---|---|---|
| Cu(1) | Pb | Sn | P | Ni | S | |
|
(1) Cu + Sum of Named Elements 99.5% min. |
||||||
| Min (%) | 3.0 | 0.03 | 0.6 | 0.10 | ||
| Max (%) | Rem | 0.09 | 5.0 | 0.35 | 1.2 | 0.50 |
| Form | Temper | Temper Code | Tensile Strength (ksi) |
YS-0.2% Offset (ksi) |
Elongation (%) |
|---|---|---|---|---|---|
| * Measured at room temperature, 68°F (20°C). | |||||
| Wire |
54 Min 87 Typ |
80 Typ |
10 Typ |
||
| Melting Point - Liquidus°F | 1926 |
|---|---|
| Melting Point - Solidus°F | 1675 |
| Densitylb/cu in. at 68°F | 0.319 |
| Specific Gravity | 8.84 |
| Electrical Conductivity% IACS at 68°F | 19.1 |
| Thermal ConductivityBtu/ sq ft/ ft hr/ °F at 68°F | 47.4 |
| Poisson's Ratioksi | 0.34 |
| Technique | Suitability |
|---|---|
| Soldering | Excellent |
| Brazing | Good |
| Machinability Rating | 70 |
Common Fabrication Processes
| Product Category | Product | Reason Category | Reason |
|---|---|---|---|
| Electrical | Electrical Connectors | Electrical Conductivity | |
| Conductors, Electrical and Thermal, High Strength |
Applicable Specifications
Corrosion Properties