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C64728
Elements | |||||||
---|---|---|---|---|---|---|---|
Cu(1,2) | Pb | Sn | Zn | Fe | Ni | Si | |
(1) Cu + Sum of Named Elements 99.5% min. (2) Cu value includes Ag. |
|||||||
Min (%) | 0.10 | 0.10 | 2.0 | 0.30 | |||
Max (%) | Rem | 0.05 | 1.0 | 2.0 | 0.20 | 3.6 | 0.9 |
Form | Temper | Temper Code | Tensile Strength (ksi) |
YS-0.2% Offset (ksi) |
---|---|---|---|---|
* Measured at room temperature, 68°F (20°C). | ||||
Flat Products | Hard | H04 |
110 Min 120 Typ 130 Max |
105 Min 115 Typ 125 Max |
Melting Point - Liquidus°F | 1913 |
---|---|
Melting Point - Solidus°F | 1868 |
Densitylb/cu in. at 68°F | 0.321 |
Specific Gravity | 8.87 |
Electrical Conductivity% IACS at 68°F | 41 |
Thermal ConductivityBtu/ sq ft/ ft hr/ °F at 68°F | 95 |
Coefficient of Thermal Expansion 68-57210 to -6 power per °F (68 – 572°F) | 9.7 |
Modulus of Elasticity in Tensionksi | 18400 |
Technique | Suitability |
---|---|
Soldering | Excellent |
Capacity for Being Cold Worked | Good |
Capacity for Being Hot Formed | Fair |
Common Fabrication Processes
Thermal Properties
Typical Uses
Applicable Specifications
Corrosion Properties