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Chemical Composition
Elements
Cu(1,2) Pb Sn Zn Fe Ni Si
(1) Cu + Sum of Named Elements 99.5% min.
(2) Cu value includes Ag.
Min (%) 0.10 0.10 2.0 0.30
Max (%) Rem 0.05 1.0 2.0 0.20 3.6 0.9
Mechanical Properties *
Form Temper Temper Code Tensile Strength
(ksi)
YS-0.2% Offset
(ksi)
* Measured at room temperature, 68°F (20°C).
Flat Products Hard H04 110 Min
120 Typ
130 Max
105 Min
115 Typ
125 Max
Physical Properties
Melting Point - Liquidus°F 1913
Melting Point - Solidus°F 1868
Densitylb/cu in. at 68°F 0.321
Specific Gravity 8.87
Electrical Conductivity% IACS at 68°F 41
Thermal ConductivityBtu/ sq ft/ ft hr/ °F at 68°F 95
Coefficient of Thermal Expansion 68-57210 to -6 power per °F (68 – 572°F) 9.7
Modulus of Elasticity in Tensionksi 18400
Fabrication Properties
Technique Suitability
Soldering Excellent
Capacity for Being Cold Worked Good
Capacity for Being Hot Formed Fair
Common Fabrication Processes

No fabrication process properties for this alloy

Thermal Properties

No thermal properties for this alloy

Typical Uses

No information for this alloy

Applicable Specifications

No applicable specifications for this alloy

Corrosion Properties

No Corrosion Properties Available.